Cover image for Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Title:
Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
ISBN:
9783030150853
Personal Author:
Edition:
2nd ed. 2020.
Publication Information New:
Cham : Springer International Publishing : Imprint: Springer, 2020.
Physical Description:
XLIX, 648 p. 473 illus., 272 illus. in color. online resource.
Contents:
The World Is Analog -- Review of Single-Crystal Silicon Properties -- PN Junctions -- Rectifying and Ohmic Contacts -- Bipolar and Junction Field-Effect Transistors -- Analog/RF CMOS -- High-Voltage and Power Transistors -- Passive Components -- Process Integration -- Mismatch and Noise -- Chip Reliability.
Abstract:
This book covers modern analog components, their characteristics, and interactions with process parameters. It serves as a comprehensive guide, addressing both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. Based on the authors' extensive experience in the development of analog devices, this book is intended for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science. Enables engineers to understand analog device physics, and discusses important relations between process integration, device design, component characteristics, and reliability; Describes in step-by-step fashion the components that are used in analog designs, the particular characteristics of analog components, while comparing them to digital applications; Explains the second-order effects in analog devices, and trade-offs between these effects when designing components and developing an integrated process for their manufacturing.
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Language:
English