Advanced Microsystems for Automotive Applications 2007
Title:
Advanced Microsystems for Automotive Applications 2007
ISBN:
9783540713258
Edition:
1st ed. 2007.
Publication Information New:
Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2007.
Physical Description:
XVI, 340 p. online resource.
Series:
VDI-Buch,
Contents:
Market -- Pressure Monitoring Sensing Market - Who will win the Race between Hybrid vs Monolithic Integrated Products? -- Prospects and Strategic Considerations for Automotive MEMS Component Suppliers and System Integrators -- Safety -- Reduced Stopping Distance by Radar-Vision Fusion -- Networking Sensors and Actuators for a New Active Headrest -- Classification of Road Conditions - to Improve Safety -- New European Approach for Intersection Safety - Results of the EC-Project INTERSAFE -- Exploiting Latest Developments in Signal Processing and Tracking for "Smart" Multi-Sensor Multi-Target ACC -- Enhancing ACC Stop&Go with Digital Map Information -- Landmark Navigation for Robust Object Tracking in Skidding Maneuvers Using Laser Scanners -- Fast Fusion of Range and Video Sensor Data -- Pedestrian Protection Systems using Cooperative Sensor Technology -- Powertrain -- Misfire Detection System based on the Measure of Crankshaft Angular Velocity -- "Intelligent" High Pressure Sensor for Automotive Application -- Networked Vehicle -- Embedded Security Solutions for Automotive Applications -- Automotive 1 Gbit/s Link opens New Century in Car HMI and Driver Assistance Systems -- The ConnectedDrive Context Server - flexible Software Architecture for a Context Aware Vehicle -- Components and Generic Sensor Technologies -- Sensors for Active and Passive Safety Systems -- Failure Mechanism Analysis as Enabler for improved Test and Reliability Strategy - the Road to Success? -- Intelligent Low-Power Management and Concepts for Battery-less Direct Tire Pressure Monitoring Systems (TPMS) -- Inertial Sensor Performance for Diverse Integration Strategies in Automotive Safety -- Far Infrared Low-Cost Uncooled Bolometer for Automotive Use -- New MEMS Timing References for Automotive Applications -- MEMS Gyroscopes for Automotive Applications -- Silicon Technology enabling Cost effective HAR Structures -- High-End Inclinometers - Evolution of Digital Platform towards Performance, Safety and Sensor Fusion.
Abstract:
Looking back when the International Forum on Advanced Microsystems for Automotive Application (AMAA) started, enormous progress has been made in reducing casualties, emissions and in increasing comfort and performance. Microsystems in many cases provided the key functions for this progress. Although the issues the event concentrated on didn't change significantly (safety, powertrain, comfort, etc.), considerable shifts of technological paradigms and approaches can be stated. The future of microsystems will consist of integrated smart systems which are able to diagnose a situation, to describe and to qualify it. They will be able to identify and mutually address each other. They will be predictive and therefore they will be able to decide and help to decide. Smart systems will enable the automobile to interact with the environment, they will perform multiple tasks and assist a variety of activities. Smart systems will be highly reliable, often networked and energy autonomous. There is a coincidence of the AMAA objectives and those of EPoSS, the European Technology Platform on Smart Systems Integration, contributing intensively to the development of automotive-specific smart systems. You will find a series of the EPoSS items in the programme of the 11th AMAA, which continues to be a unique exchange forum for companies in the automotive value chain. The publication in hand also reflects these issues. It is a cut-out of new technological priorities in the area of microsystems-based smart devices and opens up a mid-term perspective of future smart systems applications in automobiles. Additional information is available on www.amaa.de.
Added Corporate Author:
Electronic Access:
Full Text Available From Springer Nature Engineering 2007 Packages
Language:
English