Advances in Electronic Circuit Packaging Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19-21, 1964
Title:
Advances in Electronic Circuit Packaging Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19-21, 1964
ISBN:
9781489973078
Personal Author:
Edition:
1st ed. 1965.
Publication Information New:
New York, NY : Springer US : Imprint: Springer, 1965.
Physical Description:
VI, 297 p. 267 illus. online resource.
Added Corporate Author:
Language:
English