Imagen de portada para Advances in Electronic Circuit Packaging Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19-21, 1964
Advances in Electronic Circuit Packaging Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19-21, 1964
Título:
Advances in Electronic Circuit Packaging Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19-21, 1964
ISBN:
9781489973078
Edición:
1st ed. 1965.
PRODUCTION_INFO:
New York, NY : Springer US : Imprint: Springer, 1965.
Descripción física:
VI, 297 p. 267 illus. online resource.
Autor corporativo añadido:
Idioma:
Inglés