Proceedings of the symposia on interconnects, contact metallization, and multilevel metallization and reliability for semiconductor devices, interconnects, and thin insulator materials
Título:
Proceedings of the symposia on interconnects, contact metallization, and multilevel metallization and reliability for semiconductor devices, interconnects, and thin insulator materials
ISBN:
9781566770675
PRODUCTION_INFO:
Pennington, NJ : Electrochemical Society, c1993.
Descripción física:
xiii, 494 p. : ill. ; 23 cm.
Serie:
Proceedings ; v. 93-25
Proceedings (Electrochemical Society) ; v. 93-25.
Nota general:
"Dielectric Science and Technology and Electronics Divisions."
Papers presented at two symposia, the Third International Symposium on Interconnects, Contact Metallization, and Multilevel Metallization and the Symposium on Reliability of Semiconductor Devices, Interconnects, and Thin Insulators Materials, held during the 183rd Meeting of the Electrochemical Society in Honolulu, Hawaii, May 16-21, 1993.
Spine title: Interconnects, contact metallization, and multilevel metallization/reliability for semiconductor devices, interconnects, and thin insulator materials.
Término de la materia:
Autor añadido:
Título añadido:
Interconnects, contact metallization, and multilevel metallization/reliability for semiconductor devices, interconnects, and thin insulator materials.
Idioma:
Inglés