1 Semiconductor Device Analysis -- 1.1 Introduction -- 1.2 The Basic Semiconductor Equations -- 1.3 Two Well Known Approximations -- 1.4 A Particular Application: The MOS Transistor -- 1.5 Some Further Applications -- 1.6 Conclusion -- References -- 2 Thermal Analysis of Semiconductor Devices -- 2.1 Introduction -- 2.2 Review of Previous Works -- 2.3 The Boundary Element Method -- 2.4 Applications -- Summary -- Acknowledgement -- References -- 3 Applications of Boundary Elements in Corrosion Engineering -- 3.1 Introduction -- 3.2 Prediction Techniques -- 3.3 Theoretical Foundations of Cathodic Protection and Galvanic Corrosion -- 3.4 Mathematical Aspects -- 3.5 Electrode Kinetics -- 3.6 Coupling of the System -- 3.7 Polarisation -- 3.8 Systems Approach -- 3.9 Example 1: Comparison of BE Results with Cathodic Protection Experiment on a Plate -- 3.10 Example 2: Cathodic Protection of Underground Pipelines -- 3.11 Example 3: Analysis of Galvanic Corrosion (A Comparison with FE Analysis) -- 3.12 Example 4: Analysis of a Galvanic Corrosion Due to a Chemical Cleaning Process -- 3.13 Example 5: Analysis of a Jacket Type Offshore Platform -- 3.14 Conclusions -- Acknowledgements -- References -- 4 Application of BEM to Galvanic Corrosion and Cathodic Protection -- 4.1 Introduction -- 4.2 Electrochemical Aspects -- 4.3 Mathematical Model -- 4.4 Boundary Element Formulation -- 4.5 Iterative Solution Procedures -- 4.6 Infinite Problems -- 4.7 Applications -- 4.8 Concluding Remarks -- Acknowledgements -- References -- 5 Capacitance of Transducers for Displacement Measurement -- 5.1 Introduction -- 5.2 Calculation of Capacitance by the Boundary Element Method -- 5.3 Numerical Results -- 5.4 Experimental Results -- 5.5 Conclusions -- Acknowledgement -- References -- 6 Electroplating -- 6.1 Introduction -- 6.2 Mathematical Formulation -- 6.3 Boundary Element Formulation -- 6.4 Solution of the Nonlinear System -- 6.5 Development of a One-dimensional Model -- 6.6 Numerical Examples -- 6.7 Conclusions -- Acknowledgement -- References -- 7 Simulation of an Electrochemical Plating Process -- 7.1 Introduction -- 7.2 Equations -- 7.3 Boundary Element Method -- 7.4 Experiment -- 7.5 Results -- 7.6 Conclusions -- Acknowledgements -- References -- 8 Electrochemical Cell Design -- 8.1 Introduction -- 8.2 Fundamental Equations -- 8.3 Boundary Conditions -- 8.4 Types of Distributions, the Wagner Number -- 8.5 Electrode Shape Change and Moving Boundaries -- 8.6 Solution of the Potential Model -- 8.7 Solution of Electrode Shape Changes -- References -- 9 Inverse Problems and Some Applications -- 9.1 Introduction -- 9.2 Fields of Application of Inverse Problems -- 9.3 Application of Boundary Element Methods -- 9.4 Numerical Simulation -- 9.5 Improvement of the Boundary Determination Capability -- References.