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Advances in Electronic Circuit Packaging Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado
Titre:
Advances in Electronic Circuit Packaging Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado
ISBN (Numéro international normalisé des livres):
9781489973115
Auteur personnel:
Edition:
1st ed. 1962.
PRODUCTION_INFO:
New York, NY : Springer US : Imprint: Springer, 1962.
Description physique:
XV, 328 p. 176 illus. online resource.
Auteur collectif ajouté:
Langue:
Anglais