Image de couverture de Advances in Electronic Circuit Packaging Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19-21, 1964
Advances in Electronic Circuit Packaging Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19-21, 1964
Titre:
Advances in Electronic Circuit Packaging Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19-21, 1964
ISBN (Numéro international normalisé des livres):
9781489973078
Auteur personnel:
Edition:
1st ed. 1965.
PRODUCTION_INFO:
New York, NY : Springer US : Imprint: Springer, 1965.
Description physique:
VI, 297 p. 267 illus. online resource.
Auteur collectif ajouté:
Langue:
Anglais