Packaging of High Power Semiconductor Lasers
Başlık:
Packaging of High Power Semiconductor Lasers
ISBN:
9781461492634
Personal Author:
Edition:
1st ed. 2015.
Yayın Bilgileri:
New York, NY : Springer New York : Imprint: Springer, 2015.
Fiziksel Tanımlama:
XV, 402 p. 497 illus., 386 illus. in color. online resource.
Series:
Micro- and Opto-Electronic Materials, Structures, and Systems,
Contents:
Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
Abstract:
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
Ek Kurum Yazarı:
Elektronik Erişim:
Full Text Available From Springer Nature Energy 2015 Packages
Dil:
English