High-Frequency Characterization of Electronic Packaging
Başlık:
High-Frequency Characterization of Electronic Packaging
ISBN:
9781461556237
Personal Author:
Edition:
1st ed. 1998.
Yayın Bilgileri:
New York, NY : Springer US : Imprint: Springer, 1998.
Fiziksel Tanımlama:
XII, 158 p. online resource.
Series:
Electronic Packaging and Interconnects ; 1
Contents:
1: Electronic Packaging and High Frequencies -- 1.1 Packaging and high-frequency effects -- 1.2 Overview of the book chapters -- References -- 2: Electrical Description of Electronic Packaging -- 2.1 Introduction -- 2.2 Circuit descriptions -- 2.3 Qualitative characteristics -- 2.4 Conclusions -- References -- 3: High-Frequency Measurement Techniques -- 3.1 Introduction -- 3.2 Frequency-domain instruments -- 3.3 Time-domain network analyzer -- 3.4 Comparison of frequency- and time-domain network analyzers -- 3.5 Error correction -- 3.6 Conclusion -- References Appendix 3.A: Spatial resolution of the TDR/T-technique -- 4: High-Frequency Measurement Techniques for Electronic Packaging -- 4.1 Introduction -- 4.2 General test fixtures -- 4.3 Dedicated test fixtures with coaxial-planar transitions -- 4.4 On-board probing -- 4.5 Comparison of the coaxial-planar and coplanar probe transitions -- 4.6 De-embedding -- 4.7 Measuring 2N-port structures with two-port instruments -- 4.8 Conclusion -- References -- 5: Measurement-Based Modeling Algorithms -- 5.1 Introduction -- 5.2 One-port components -- 5.3 Transmission lines -- 5.4 General interconnections and packaging -- 5.5 Conclusions -- References.
Abstract:
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
Ek Kurum Yazarı:
Elektronik Erişim:
Full Text Available From Springer Nature Engineering Archive Packages
Dil:
English