Advances in Electronic Circuit Packaging Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado
Başlık:
Advances in Electronic Circuit Packaging Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado
ISBN:
9781489973115
Personal Author:
Edition:
1st ed. 1962.
Yayın Bilgileri:
New York, NY : Springer US : Imprint: Springer, 1962.
Fiziksel Tanımlama:
XV, 328 p. 176 illus. online resource.
Ek Kurum Yazarı:
Dil:
English