Proceedings of the symposia on interconnects, contact metallization, and multilevel metallization and reliability for semiconductor devices, interconnects, and thin insulator materials
题名:
Proceedings of the symposia on interconnects, contact metallization, and multilevel metallization and reliability for semiconductor devices, interconnects, and thin insulator materials
ISBN:
9781566770675
PRODUCTION_INFO:
Pennington, NJ : Electrochemical Society, c1993.
物理描述:
xiii, 494 p. : ill. ; 23 cm.
系列:
Proceedings ; v. 93-25
Proceedings (Electrochemical Society) ; v. 93-25.
一般注释:
"Dielectric Science and Technology and Electronics Divisions."
Papers presented at two symposia, the Third International Symposium on Interconnects, Contact Metallization, and Multilevel Metallization and the Symposium on Reliability of Semiconductor Devices, Interconnects, and Thin Insulators Materials, held during the 183rd Meeting of the Electrochemical Society in Honolulu, Hawaii, May 16-21, 1993.
Spine title: Interconnects, contact metallization, and multilevel metallization/reliability for semiconductor devices, interconnects, and thin insulator materials.
附加著者:
附加题名:
Interconnects, contact metallization, and multilevel metallization/reliability for semiconductor devices, interconnects, and thin insulator materials.
语言:
英文